This Unique Conference, organised by NMI and IMAPS-UK, being held within the Mitel Facility is your opportunity to Learn how embedded die technology can miniaturise, improve performance and reduce cost for applications such as power, wireless and wearables.
Electronic Systems increasingly lie at the heart of the infrastructure and applications we take for granted in everyday life. From mobile phones and tablets through to connected autonomous vehicles, Medical devices, renewable energy controllers and many more. Many of these applications require increased levels of integration and miniaturisation which has traditionally come from Die Shrink (Moores Law) and Package Integration (MCM, POP, etc).
Embedded Die Technology (EDT) provides an opportunity for high levels of integration at competitive price as alternative to technology such as 2.5D TSV. EDT in particular offers considerable benefits such as high I/O density, multi-die, small footprint and flexible routing. NMI in partnership with IMAPS-UK are delighted to announce this UK first Premier Conference on EDT Technology which will offer those involved with placement of die and components within the PCB and those involved with Die Package and Interconnection Technologies, an opportunity to learn about EDT Technology, Process Tools and Flows, Materials Selection / Options, Design – Industrialisation and Applications that are being enabled by EDT technology.
Don’t miss this opportunity to hear from and network with experts, share thinking with peers and meet our Exhibitors from the Packaging Supply Chain at the co-located exhibition.
09:30 Welcome and introduction – NMI, IMAPS-UK & Sponsors
09:45 Keynote on Embedded Technologies Introduction and Applications – Andreas Ostmann, Fraunhofer
** Session 1 – EDT Technologies **
10:25 Technology Overview – Nick Pearne, BPA Consulting
11:30 System Design Needs for EDT – Kevin Cannon, Tribus-D
11:55 Modelling EDT Systems – Dr Stoyan Stoyanov, Greenwich University
12:20 Analysis, Test and Reliability of EDT Systems – Andrew Richardson, Lancaster University
12:45 Exhibitor Elevator Pitches 13:05 LUNCH – Table Top Exhibits, Networking
** Session 2 – EDT Enabled Applications **
14.05 EDT for Power devices – Cyril Buttay, InSA 14:30 EDT and Flex Die – Buddhadev Chaudhuri, MbedICs – IMEC
** Session 3 – Applications Enabled by EDT **
15:35 Standardisation Activities in EDT – Chris Hunt, NPL
16:00 Customised EDT – Piers Tremlett, Microsemi
16:25 Power Devices in EDT – Dr Kay Essig, ASE
16.50 Summary and Wrap up Session
17:00 Event Close
Ticket Prices NMI and IMAPS-UK Members – £75+VAT Non-Members – £125+VAT Students – £45+VAT Partners – £105+VAT